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Shikun Electronics Co., Ltd
ShenzhenshikunTechnology Co., Ltd
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808-AG11D-LF

Mfr.Part # : 808-AG11D-LF

Manufacturer : TE Connectivity AMP Connectors

Description : CONN IC DIP SOCKET 8POS GOLD

Stock : 2657

Product Category : IC Sockets

Contact Finish - Mating : Gold

Contact Finish - Post : Gold

Contact Finish Thickness - Mating : 25.0µin (0.63µm)

Contact Finish Thickness - Post : 25.0µin (0.63µm)

Contact Material - Mating : Beryllium Copper

Contact Material - Post : Copper

Features : Open Frame

Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Mounting Type : Through Hole

Number of Positions or Pins (Grid) : 8 (2 x 4)

Operating Temperature : -55°C ~ 105°C

Product Status : Obsolete

Termination : Solder

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