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Mfr.Part # : 808-AG11D-LF
Manufacturer : TE Connectivity AMP Connectors
Description : CONN IC DIP SOCKET 8POS GOLD
Stock : 2657
Product Category : IC Sockets
Contact Finish - Mating : Gold
Contact Finish - Post : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Contact Material - Post : Copper
Features : Open Frame
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Mounting Type : Through Hole
Number of Positions or Pins (Grid) : 8 (2 x 4)
Operating Temperature : -55°C ~ 105°C
Product Status : Obsolete
Termination : Solder
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808-AG11D-LF Images |