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DILB24P-223TLF

Mfr.Part # : DILB24P-223TLF

Manufacturer : Amphenol Communications Solutions

Description : CONN IC DIP SOCKET 24POS TINLEAD

Stock : 558

Product Category : IC Sockets

Contact Finish - Mating : Tin-Lead

Contact Finish - Post : Tin-Lead

Contact Finish Thickness - Mating : 100.0µin (2.54µm)

Contact Finish Thickness - Post : 100.0µin (2.54µm)

Contact Material - Mating : Copper Alloy

Contact Material - Post : Copper Alloy

Features : Open Frame

Housing Material : Polyamide (PA), Nylon

Mounting Type : Through Hole

Number of Positions or Pins (Grid) : 24 (2 x 12)

Operating Temperature : -55°C ~ 125°C

Product Status : Active

Termination : Solder

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