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Mfr.Part # : DILB24P-223TLF
Manufacturer : Amphenol Communications Solutions
Description : CONN IC DIP SOCKET 24POS TINLEAD
Stock : 558
Product Category : IC Sockets
Contact Finish - Mating : Tin-Lead
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Mating : 100.0µin (2.54µm)
Contact Finish Thickness - Post : 100.0µin (2.54µm)
Contact Material - Mating : Copper Alloy
Contact Material - Post : Copper Alloy
Features : Open Frame
Housing Material : Polyamide (PA), Nylon
Mounting Type : Through Hole
Number of Positions or Pins (Grid) : 24 (2 x 12)
Operating Temperature : -55°C ~ 125°C
Product Status : Active
Termination : Solder
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